AMD's next-generation Zen 6 architecture, codenamed "Medusa," is reportedly in development.
According to leaks, the consumer-grade Zen 6 CPUs may utilize an innovative 2.5D chiplet design with enhanced interconnects, significantly boosting performance. This design is said to facilitate higher chip-to-chip bandwidth, allowing Zen 6 CCDs to communicate faster through both the CCDs themselves and the IOD.
The leaks also suggest that Ryzen Zen 6 desktop processors will not feature CCDs stacked on the IOD due to high production costs.
AMD may experiment with such designs in the future, similar to the 3D V-Cache stacking on Ryzen 5000 chips, with further refinement on Ryzen 7000 SKUs.
Based on previous information, the AMD Zen 6 core architecture, codenamed "Morpheus," is expected to release in the 2025-2026 timeframe.
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