站长之家 - 业界 2024-08-09 18:21

realme 真我 13 手机现身跑分平台,预计搭载天玑 7300 系列处理器

<a href="//m.chinaz.com/tags/realme.shtml" target="_blank">realme</a> unveils <a href="//m.chinaz.com/tags/877196.shtml" target="_blank">RMX5000</a> powered by MediaTek Dimensity 7300 series

realme has announced the introduction of a new smartphone model RMX5000. The device made a mark on GeekBench benchmarking platform with a single-core score of 1043 and a multi-core score of 2925.

The new device is powered by MediaTek Dimensity 7300 series processor, which comes equipped with an Arm Mali-G615 MC2 GPU. It also supports LPDDR4x, LPDDR5 memory, and UFS 3.1 storage.

The Dimensity 7300 and Dimensity 7300X processors are both built on TSMC's 4nm process and feature an octa-core architecture comprising four Cortex-A78 cores clocked at 2.5GHz and four Cortex-A55 cores. These processors also incorporate a 12-bit HDR-ISP image processor, Imagiq 950, which can support up to 200MP primary cameras.

Beyond its impressive performance capabilities, the Dimensity 7300 and Dimensity 7300X provide support for Wi-Fi 6E, Bluetooth 5.4, dual-SIM VoNR, and an AI processor, APU 655. These processors exhibit a strong balance of performance and functionality.

For further details on the realme 13 smartphone's specifications, please stay tuned for our upcoming updates.

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